Universal^™ Nozzles

Universal^™ Summit^™ nozzles improve bond strength and product quality in hot melt adhesive applications. A wide range of nozzle designs to accommodate the perfect application pattern are compatible with all Nordson Universal^™ modules and Universal^™ applicators.

• Gain high bond strength at low add-on rates in continuous and intermittent operations.
• Control adhesive fiber size, density and pattern width for better bond performance.
• Produce low-density, large-fiber patterns for maximum bond strength; open patterns for absorbency; or highly dense fine-fiber patterns for heat-sensitive substrates.
• Achieve greater uniformity in the cross-web direction.
• Provide leak-free operation with serviceable, surface-mounted elastomeric seal